Our specialized Research & Development Center in Japan
continuously develops and improve our Okamoto’s products.
Some of our achievements that has changed the direction of
the industry are as follows:
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Downfeed grinding technology + Index
Wafer Transfer (Awarded JSME in 1996)
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Grinding machines use an unique down feed grinding
method to maintain a constant down-force to minimize
depth of damage and prevent edge chipping and a 360
degree rotating indexing table which enable thin wafer
processing without influencing machining accuracy.
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Integrating of grinding and polishing
technology
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Fully auto grinder / scanning polisher integrating
of grinding and polishing technologies for ultra thin
wafer processing which ensures that die strength remains
uniform across the wafer.
Wafer
sight view |
Normal Polishing
( Fixed speed)
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| Scanning
polishing |
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Oscillation
speed control achieves super
planarization |
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Maintian
entire wafer level strength
to be applied chip level strength |
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Lens-polishing technology
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CMP machine leverage its lens-polishing technology for
use in wafer polishing. Okamoto’s new planarization
technology revolves around its polishing head, which unlike
conventional CMP tools, is placed down on the wafer that
is face up. We utilize a much smaller pad for wafer so
that it rotates at a much higher rate of speed but with
low pressure, which will make the technology ideal for
copper, low-k and high-k application. |
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CNC
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Okamoto’s grinder can equipped with flexible CNC,
the grinders use a Fanuc CNC loaded with the company’s
software to simplify setup and operation. With CNC controlled,
it achieves an extremely high level of grinding process
and hold consistently all day long at very fine tolerances.
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“Non Contact”
type linear driver and V Super
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The grinding machine is improved by using a variable
pressure hydrostatic slide way system that minimizes and
maintains constant oil film thickness to achieve accurate
grinding.
While competitor's machines generally use ball-screw
drive and point-to-point contact ball bearing slide-ways,
our non-contact linear-drive and V-V super precision
slide ways structure hold vibration to a minimum.
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