HomeCorporate ProfileProductsServicesTechnologyGlobal PresenceSitemap
 
   
Machine Tool
Semiconductor Equipment
-
Chemical Mechanical Polishing
-
Lapping Machine
-
Grinding Machine
-
Slicing Machine
   
 
Semiconductor Equipment - Slicing Machine

Download Slicing Machine info (1.5MB)

External Blade Type Slicing Machine

FSM-250
 
 
- cut, groove at high accuracy and high efficiency on brittle materials such as glass, ferrite and ceramic
- special high rigid mechanism, structure and employ environment-free special material in drive portion

Download FSM-250 info (0.3MB) [English]

top

top