| Our refined polishing technologies are
involved products for our Semiconductor Equipment Division
and that are used in daily. Almost all areas of life,
including information media, have been highly computerized.
This necessitates that semiconductors and electronic devices
become increasingly evolved. The Semiconductor Equipment
Division supplies systems for ultra-precision finishing
categories including grinding, CMP/polishing, lapping
and slicing. Okamoto positively promotes research and
development in both hardware and software so as to quickly
satisfy customers’ requirements for advanced technologies.
We will continue to boldly challenge the expansion of
new businesses with an “ever onward” spirit.
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