| |
| - |
ability to grind semiconductor material such as
silicon, gallium arsenide, electronic material such
as ferrits and ceramic |
| - |
unique downfeed grinding method which improve
surface roughness, flatness for fragile material |
| - |
high throughout process due to grinding, transportation,
loading-unloading process taking place at a time |
Download
GNX300P info (0.2MB) [English]
|
